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Epoxy resin/carbon black composites below the percolation threshold

TitoloEpoxy resin/carbon black composites below the percolation threshold
Tipo di pubblicazioneArticolo su Rivista peer-reviewed
Anno di Pubblicazione2013
AutoriMacutkevic, J., Kuzhir P., Paddubskaya A., Maksimenko S., Banys J., Celzard A., Fierro V., Stefanutti E., Cataldo Antonino, Micciulla F., and Bellucci S.
RivistaJournal of Nanoscience and Nanotechnology
Volume13
Paginazione5434-5439
Parole chiaveBroad-band dielectric spectroscopy, Carbon black, Composite materials, Dielectric characteristics, Dielectric permittivities, Dielectric properties of solids, electrical conductivity, epoxy, Epoxy resins, Filled polymers, Percolation (computer storage), Percolation (fluids), Percolation thresholds, Permittivity, Polymer-filler interface, Properties of composites, Resins
Abstract

A set of epoxy resin composites filled with 0.25-2.0 wt.% of commercially available ENSACO carbon black (CB) of high and low surface area (CBH and CBL respectively) has been produced. The results of broadband dielectric spectroscopy of manufactured CB/epoxy below the percolation threshold in broad temperature (200 K to 450 K) and frequency (20 Hz to 1 MHz) ranges are reported. The dielectric properties of composites below the percolation threshold are mostly determined by alpha relaxation in pure polymer matrix. The glass transition temperature for CB/epoxy decreases in comparison with neat epoxy resin due to the extra free volume at the polymer-filler interface. At room temperature, the dielectric permittivity is higher for epoxy loaded with CBH additives. In contrast, at high temperature, the electrical conductivity was found to be higher for composites with CBL embedded. The established influence of the CB surface area on the broadband dielectric characteristics can be exploited for the production of effective low-cost antistatic paints and coatings working at different temperatures. Copyright © 2013 American Scientific Publishers All rights reserved.

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URLhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84880815102&doi=10.1166%2fjnn.2013.7547&partnerID=40&md5=e2a94411cb025d57614f1a13f776ca5e
DOI10.1166/jnn.2013.7547
Citation KeyMacutkevic20135434